Cold Plate for CPU: Direct Liquid Cooling Solutions [2024]

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Kuwana Taimanin CPU Don Kafin Gudun Mazaigari na Mai Tsokaci

Kuwana Taimanin CPU Don Kafin Gudun Mazaigari na Mai Tsokaci

Mai gudun mazaigari don kuwana taimanin CPU yana ba da kofin taimanin mai tsokaci ne akan processor da kofin mazaigari na mai tsokaci, wanda ya sa ido ya yi aiki don kuwa taimanin daga CPU ta hanyar mai tsokaci. Mai gudun mazaigari ya zuwa a cikin kofin mai tsokaci da ya kawo taimanin zuwa kofin mai tsokaci, kofin mai tsokaci na kofin ko kofin mai tsokaci na kofin. Shari ya iya raba a cikin kofin mai tsokaci, kofin mai tsokaci, kofin mai tsokaci, kofin mai tsokaci da kofin mai tsokaci. Bayani masu muhimci suna haɗa da zaɓin abu, ƙwayoyin kofin, kofin mai tsokaci, kofin mai tsokaci, kofin mai tsokaci, kofin mai tsokaci da kofin mai tsokaci. Mai gudun mazaigari na CPU suna da alaƙa ga kofin mai tsokaci, kofin mai tsokaci, kofin mai tsokaci, kofin mai tsokaci da kofin mai tsokaci. Suna iya haɗa su a cikin kofin mai tsokaci na kofin mai tsokaci don kofin mai tsokaci na kofin mai tsokaci.
Samu Kyauta

Kasar Labar

Kuwana Taimanin CPU na Kofin

Wani platform na server ta bukatar hanyar mai yawa don cire hanyar gaba daya na kuma kuma daga CPU na yawa aiki a wani lokaci da ke zama tsakanin lokaci. Wani cold plate na CPU cooling an sa hannu a sama da processor kuma an kawo shi zuwa wani liquid circulation loop. An kawo kuma supply kuma return hoses, wani manifold, kuma abubuwan da suka yi amfani da heat-rejection don tabbataci tsarin kuma flow na coolant. A lokacin da an tattaunawa aikin system, an gano thermal load na processor, bayanin mounting, compatibility na coolant, kuma space da ke cikin CPU socket. Wani direct cooling architecture an kawo wani dedicated heat-transfer path daga processor zuwa liquid circuit. Wannan hanyar zai iya amfani a dense server environments inda conventional air cooling ke cire yawa aiki a wani lokaci da ke zama tsakanin lokaci.

Kooleen HPC Processor

An HPC platform ya na amfani da high-performance CPUs wanda suka zama maimakon kuma suka yi amfani da computational workloads wanda za su iya samun yadda mai ƙarfi na thermal output. CPU cold plates an gudan su a cikin server's liquid cooling loop don samun yadda daga lokaci na processor. An kara kuma coolant flow, pressure drop, contact surface, da mounting structure don tabbatar da compatibility na computing hardware. Maimakon CPU cooling branches za su iya haɗawa ta hanyar common manifold, wanda ya ba da imkanin system don amfani da maimakon processors a cikin rack. Wannan configuration ya ba da waya mai ƙarfi don processor cooling yayi amfani da liquid cooling ta hanyar pumps, heat exchangers, da existing thermal infrastructure.

Data Center CPU Upgrade

Takardun bayanai ya sao kwayoyin sarrafa na gaba daya da CPU na yawa a matsayin su, amma ya tsaya da fassara na hawayin mai ƙarfi ga kwayoyin sarrafa na yawa. An sanya kwayoyin sarrafa na CPU (cold plates) don baiwa sarrafa na yawa ta hanyar tashin mayi. Kwayoyin sarrafa na CPU an raba su ta hanyar manifolds na kwayoyin sarrafa da kwayoyin sarrafa na mayi, kuma an yi amfani da kwayoyin sarrafa na yawa (quick disconnect interfaces) don samun dukkanin alama. Alamar yadda ake so sarrafa ya zama mai ƙarfi, halin mayi, kwayoyin sarrafa na yawa, da kuma yadda ake sauya kwayoyin sarrafa na yawa an yi amfani da su a cikin alamar yadda ake so. Wannan alamar yadda ake so ya ba da imkanin sauya kwayoyin sarrafa na yawa ta hanyar tashin mayi domin kwayoyin sarrafa na yawa kuma ba suka nuna cewa ake bukatar sauya kwayoyin sarrafa daga kowane takardun bayanai. Ya kuma ba da imkanin sauya kwayoyin sarrafa na yawa da kuma kwayoyin sarrafa na yawa na yawa da kuma kwayoyin sarrafa na yawa na yawa.

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Kulun kwayar CPU shi ne abu na kula da yadda ake saukin hanyar maya gaba daya daga CPU zuwa mai saukin wani abu. Kananan kwayar suka nuna yadda ake taimakawa da saukin gaba daya, amma kafin kwayar ya zama da jarrabu na kula da CPU ta hanyar kuma yadda ake saukin gaba daya. A cikin wani lokaci, kulun kwayar zai iya raba a cikin kwayar CPU, kwayar soket, saukin gaba daya, yadda ake taimakawa da saukin gaba daya, yadda ake taimakawa da saukin gaba daya, yadda ake taimakawa da saukin gaba daya, da yadda ake taimakawa da saukin gaba daya. Kopper, aluminum, ko wani abu na kula da yadda ake saukin gaba daya zai iya raba a cikin wani lokaci. Kulun kwayar CPU zai iya amfani da su a cikin servers, data centers, HPC systems, workstations, da wani abu na kula da yadda ake saukin gaba daya. Suna iya amfani da su a cikin manifolds, pumps, hoses, quick disconnects, da heat exchangers don haɗa kuli da kula da yadda ake saukin gaba daya.

Masu Sabon Gaskiya

Wani abu ne wanda ke nufin kwayon sarrafa na CPU?

Kuldi na CPU shi ne abu na kula da yadda ya zama a cikin wani processor don samun yadda daga wani coolant na gudanarwa. Kananan na gaba na kuldi suka bada imkanin don coolant in samun yadda daga tushen CPU kuma in rufe ta a cikin kuldi na kula, kuldi na bayani na kula, ko wani abu na kula da yadda.
CPU na kara yawa zai iya samun yadda mai yawa a lokacin da suka yi aiki da kariya. Kuldi na kula ya sanya kula na kula a cikin processor, kuma yana samun kula na kula na coolant. Wannan zai iya taimaka a lokacin da suka yi aiki da kariya, sistem na HPC, data centers, ko wani baki na kula da yadda wanda kula na hawa ba za ta iya samun yadda mai yawa.
Copper da aluminum suna ƙasa ta yau da kullum, amma azanci na muhimmi zai dace da conductivity na kuma, wuche, bukatar samun, kuma kuskure na coolant. Materia na cold plate zai kamata a gano ta hanyar tattaunawa da tubing, fittings, coolant, da wani abu masu kusa don tabbatawa cikin tsari na liquid cooling.
Cold plate ya saukin haɗa da supply da return coolant lines ta hanyar hoses, fittings, ko quick disconnect couplings. Manifold zai iya ba coolant ga mahauci na CPU cold plates, amma pumps zai iya tsara circulation. Coolant mai kuma zai tattara zuwa kuma heat-rejection equipment baya yayi kuma a cikin tsari na cooling.
Amsanar da za a yi amfani da kamarin CPU, socket da kuma shirin haɗa, ƙarfi na yin gurba, nau’in coolant, tsarin yin gurba, ƙarfi na gurba, yadda yake aiki, da wani abu ne da ke cikin gaba daya. Kuma amsanar da kyakkyawan haɗa da kuma haɗa da karami suka kashe. Don hanyoyin da suka biyu ko karin CPU, cold plate ya kamata ya haɗa da manifold da kuma hanyar yin gurba ta coolant.

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Sahihun Malli

Andrew Miller

Cold plates na CPU sun haɗa da kyakkyawa ga karamin coolant na server mu. Kamarin da ke ƙasa ya taimaka mu don saita tsarin coolant domin yin gurba ta hanyar da ke cikin gaba daya ga CPU su da yawa.

Thomas Carter

Mu haɗa cold plates na CPU a cikin mahaɗin HPC da suka biyu ko karin da su, kuma mu haɗa su ta hanyar da ke cikin gaba daya na manifold. Tsarin da ke cikin gaba daya ya taimaka mu don saita da karewa ga karamin da suke aiki.

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haɗawa ta hanyar kudin haɗawa ta hanyar kudin na likwidai haɗawa ta hanyar likwidai kudin sanyaya na likwidai na kudin data kabili na kula da yadda mai zuba kabili na kula da yadda mai zuba a cikin mikro kula ta hanyar tashin chip kula biyu a hanyar tashin chip kula a cikin rack mai zuba kabili na kula don CPU kabili na kula don GPU sistem na kula ta hanyar tashin chip
Kula ta hanyar direk na CPU

Kula ta hanyar direk na CPU

Kold peit don kula da CPU ya kula jarrabba daga processor zuwa tsarin mayi, kuma yana samu tarihi mai ƙarfi da ƙarfi na kula. Mayi ya tashi a cikin kanalolin da suka ƙare gaba daya na yankin kula wanda ke kula jarrabba daga CPU. Kula ta zama mai kyau wajen abubuwan da suka gabata: kyakkyawan kula na yankin kula, tsarin kanaloli, yadda mayi ya tashi, yadda processor ya yi amfani da shi, da dukkan bayanin kayan aiki. Kold peit zai iya haɗawa da manifol, pomp, hose, da heat exchanger don samun tsarin kula ta hanyar direk. Wannan tsarin ta hanyar direk yana da alaƙa ga serverin da suka fiye da kyau da sistem na kompyuta wanda suka yi amfani da processor a lokacin da suka fiye da amfani da shi da suka samu jarrabba mai ƙarfi a wani yanki mai ƙarfi.
Tsarin Kafa na Kula da Kyau

Tsarin Kafa na Kula da Kyau

Kafafun kula na ƙasa suna iya zama babu wani abu da ya sauri a cikin kula da CPU cold plate yayi kula da hanyar yin amfani da coolant pressure. Bayanai na kafafun kula, hanyar yin amfani da coolant, lokaci na shigo da furo, da kuma tsarin kafa na gaba na kula zasu iya rarraba a cikin kula da processor da aka zamani da lokacin amfani. Sistemin kula yana bukatar kula da kyau da kula da kyau na flow resistance don haka pumps zasu iya kula da circulation da aka zamani. Tsarin kafa na gaba da pressure na kafa kuma suna da mahimmanci saboda kula da kyau na kula da cold plate da thermal interface zasu iya taimaka wajen kula da kyau na kula. Daga cikin kula da CPU thermal load, coolant properties, flow rate, da kuma mechanical constraints, cold plate zasu iya kula da kyau a cikin direct liquid cooling architecture.
Kula da Maza'abu na CPU da iya rarraba

Kula da Maza'abu na CPU da iya rarraba

Takaddun na data da takaddun na HPC zasu iya amfani da mahaullin da suka biyu ko kuma da suka fiye ne a cikin wani server daya ko a tsakanin mahaullin da suka dace. Mahaullin na CPU zasu iya wasuwa ta hanyar manifolds don samun tashin yadda da kariya na coolant don mahaullin da suka biyu ko kuma da suka fiye. Kariyoyin tashin yadda zasu iya rarraba a cikin hausa na yadda da kariya da suka bukatar CPU daya, amma al'adu na tashin yadda zasu iya wasuwa ta hanyar pump da abubuwan da suka bukatar kariya. Kariyoyin da suka dace don wasuwa zasu iya ba da fasahin da suka dace lokacin da servers suka bukatar sani ko wasuwa. Wannan tsarin da suka dace yana ba da imkanin yadda na tashin yadda don zama mai yawa a matsayin tsarin na computing. Yana da imkanin yadda na hybrid inda tashin yadda ana amfani da ita a mahaullin da suka fiye a yadda da abubuwan da suka dace zasu iya amfani da tashin yadda na hawaye.

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