Two-Phase Direct to Chip Cooling: AI & HPC Thermal Solution

A two phase direct to chip cooling system uses phase-change heat transfer to remove thermal energy directly from CPUs, GPUs, or other high-power semiconductor devices. A working fluid absorbs heat at the chip-level cooling interface and transitions from liquid to vapor. The vapor then moves toward a condenser, where heat is rejected and the fluid returns to the cooling circuit. Depending on the architecture, the system may include evaporators or specialized cold plates, condensers, reservoirs, manifolds, pumps, control valves, sensors, and monitoring equipment. System design should consider heat flux, operating pressure, fluid characteristics, thermal load, condensation capacity, flow behavior, materials compatibility, and maintenance requirements. This technology can be considered for AI servers, HPC systems, data centers, and other high-density computing applications.