Coolant Distribution Units (CDU) for AI & HPC Data Centers

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Flexible Coolant Management for High-Density Computing Systems

Flexible Coolant Management for High-Density Computing Systems

Coolant distribution units provide controlled liquid cooling between facility infrastructure and high-density IT equipment. They manage coolant circulation, distribution, temperature, and pressure across server and rack-level cooling loops. Depending on system requirements, a CDU can incorporate pumps, heat exchangers, manifolds, valves, filters, sensors, monitoring systems, and control components. Configurations can be adapted to total thermal load, coolant flow rate, supply and return temperatures, operating pressure, fluid properties, rack density, and installation conditions. For direct-to-chip applications, coolant distribution units can deliver fluid to CPU, GPU, and accelerator cold plates while collecting warmed coolant for heat rejection. Their modular architecture supports AI data centers, HPC clusters, cloud infrastructure, telecom facilities, and enterprise computing environments where increasing rack power requires more controlled and scalable thermal management.
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Case Study

AI GPU Cluster Cooling

An AI computing facility was deploying multiple GPU servers with high rack-level thermal loads and required a centralized approach to liquid cooling. Coolant distribution units were configured to circulate technology-side coolant between the cooling infrastructure and individual rack circuits. Supply and return manifolds connected the CDUs with GPU cold plates through hoses and quick disconnect couplings. Engineers evaluated total thermal load, flow requirements, pressure drop, supply and return temperatures, and coolant compatibility when planning the system. Monitoring sensors could be integrated to track key operating conditions. The modular distribution architecture allowed multiple GPU racks to share coordinated coolant management while leaving connection capacity for future AI server expansion and increased computing density.

HPC Cooling Infrastructure

An HPC facility needed to improve thermal management for a cluster containing high-performance CPUs, GPUs, and accelerators. Coolant distribution units provided an interface between the facility cooling loop and dedicated technology-side circuits. Each CDU could distribute coolant through rack manifolds toward processor cold plates and collect the warmed return fluid. The cooling architecture was planned around cluster heat load, branch flow requirements, operating pressure, supply temperature, return temperature, coolant chemistry, and maintenance requirements. Pumps, heat exchangers, valves, filters, and monitoring components could be incorporated according to system needs. This configuration provided structured coolant management across several HPC racks while allowing the facility to add additional liquid-cooled equipment as computational requirements increased.

Data Center Cooling Expansion

A data center was introducing liquid cooling for selected high-density racks while maintaining existing facility cooling infrastructure. Coolant distribution units were used to create dedicated technology-side cooling circuits for new liquid-cooled servers. The units distributed coolant through rack manifolds and collected warmed fluid from server cold plates before returning it for heat rejection. Engineers considered rack thermal load, coolant flow, pressure conditions, supply and return temperatures, available facility capacity, and installation space. Additional valves, pumps, filtration, sensors, and heat exchange components could be configured according to the project architecture. The modular approach allowed liquid cooling to be deployed in stages and provided a practical path for expanding the number of cooled racks as server power density increased.

Related products

Coolant distribution units are designed to manage liquid coolant between cooling sources and high-density IT equipment. A CDU can circulate fluid, distribute it across multiple cooling branches, and collect warmed coolant for heat rejection or recirculation. Depending on the architecture, the system may include pumps, heat exchangers, manifolds, valves, filters, sensors, controls, and monitoring interfaces. Direct-to-chip cooling systems can use CDUs to supply coolant to CPU, GPU, and accelerator cold plates through dedicated rack-level loops. Key design parameters include thermal load, coolant flow rate, supply and return temperatures, operating pressure, pressure drop, fluid compatibility, heat exchanger capacity, number of connected racks, and future expansion requirements. Coolant distribution units can support AI data centers, HPC clusters, cloud computing facilities, telecom infrastructure, and enterprise server environments. Their modular configuration allows cooling capacity and distribution connections to be planned around current and future high-density computing requirements.

Frequently Asked Questions

What are coolant distribution units?

Coolant distribution units, commonly called CDUs, manage liquid coolant between facility cooling infrastructure and technology-side equipment loops. They can circulate fluid, regulate flow and temperature, distribute coolant to multiple rack circuits, and collect warmed return fluid. CDUs are widely applicable to liquid-cooled servers, AI systems, HPC environments, and high-density data centers.
CDUs provide a controlled interface between facility cooling systems and IT equipment. They can circulate and distribute coolant while managing temperature, pressure, and flow conditions. Depending on the architecture, a CDU can also transfer heat through a heat exchanger and support multiple rack-level or direct-to-chip cooling circuits.
Yes. CDUs can supply coolant to GPU cold plates through dedicated supply and return circuits. The system can be configured around GPU thermal load, required flow rate, pressure drop, coolant properties, supply temperature, return temperature, and the number of connected servers or racks. This makes CDUs suitable for high-density AI infrastructure.
A CDU can include pumps, heat exchangers, manifolds, valves, filters, sensors, controls, and monitoring equipment. The actual configuration depends on cooling capacity, rack density, coolant type, facility-side conditions, technology-side requirements, installation space, maintenance access, and the number of connected cooling loops.
Selection should consider total thermal load, coolant flow rate, supply and return temperatures, operating pressure, pressure drop, fluid compatibility, heat exchanger capacity, rack count, connection requirements, and future expansion. Facility cooling capacity, installation space, monitoring requirements, maintenance access, and integration with existing infrastructure should also be evaluated.

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Customer Testimonials

Daniel Brooks

The CDU configuration gave us a structured way to connect multiple liquid-cooled racks. Supply and return manifolds helped organize the cooling loops and simplify expansion during deployment.

Kevin Morgan

We integrated CDUs with several GPU server racks and dedicated cooling loops. The modular arrangement made coolant management more straightforward during the data center upgrade.

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Centralized Coolant Management

Centralized Coolant Management

Coolant distribution units provide centralized management of liquid cooling for high-density computing infrastructure. A CDU can receive coolant from a facility-side source and circulate it through a dedicated technology-side loop serving one or multiple server racks. Pumps support fluid circulation, while manifolds divide coolant between individual branches according to equipment requirements. Sensors can monitor temperature, flow, and pressure conditions, while valves and filters may support control and maintenance functions. Where primary and secondary loops are separated, a heat exchanger can transfer thermal energy without directly mixing the fluids. This architecture is suitable for AI, HPC, cloud, and enterprise data centers that require organized coolant delivery and controlled thermal conditions across multiple high-power computing systems.
Direct-to-Chip Cooling Support

Direct-to-Chip Cooling Support

Coolant distribution units can be integrated with direct-to-chip cooling architectures for CPUs, GPUs, and accelerators. The CDU supplies coolant through manifolds, hoses, and quick disconnect couplings to cold plates mounted directly on high-power processor packages. After absorbing heat, the warmed fluid returns through the technology-side circuit toward the CDU. System configuration can be based on processor thermal load, flow rate, pressure drop, supply and return temperatures, and coolant compatibility. This approach provides a controlled liquid path between cooling equipment and individual server components. It is particularly suitable for AI training and inference servers, HPC clusters, and other high-density computing systems where processor heat loads are increasing beyond the practical range of conventional air cooling.
Scalable Rack-Level Deployment

Scalable Rack-Level Deployment

Coolant distribution units can provide a modular foundation for scaling liquid cooling across data center racks. A system may begin with selected high-density AI or HPC racks and expand as additional servers require liquid cooling. Distribution manifolds, pumps, valves, sensors, filters, hoses, and quick disconnects can be configured around the installation layout and operating requirements. Engineers can evaluate total thermal load, flow capacity, pressure conditions, coolant temperature, fluid compatibility, and facility cooling capacity when planning the CDU network. This modular architecture helps maintain organized supply and return paths while providing defined connection points for future equipment. It can support phased deployment across AI clusters, cloud platforms, research computing facilities, and enterprise data centers with evolving rack power requirements.

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